发明名称 Semiconductor temperature sensitive switching device with short carrier lifetime region
摘要 A semiconductor heat sensitive switching device comprises A FIRST SEMICONDUCTOR LAYER HAVING THE FIRST CONDUCTIVE TYPE; A SECOND SEMICONDUCTOR LAYER HAVING THE SECOND CONDUCTIVE TYPE FOR FORMING THE FIRST EMITTER PN junction which is disposed in the first semiconductor layer to be substantially parallel of one main surface to the bottom surface and to contact them at the end; and A THIRD SEMICONDUCTOR LAYER HAVING THE SECOND CONDUCTIVE TYPE FOR FORMING THE COLLECTOR PN junction which is disposed in the first semiconductor layer with a space to the second semiconductor layer to be substantially parallel of one main surface to the bottom surface and to contact them at the end, and a high thermal carrier generation rate region which is formed in the depletion layer region of the bottom surface of the third semiconductor layer.
申请公布号 US4081818(A) 申请公布日期 1978.03.28
申请号 US19760732545 申请日期 1976.10.14
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 NAKATA, JOSUKE
分类号 H01L35/00;H01L29/167;H01L29/66;H01L29/74;(IPC1-7):H01L23/56;H01L29/72 主分类号 H01L35/00
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