发明名称 MOLD RELEASE AGENT
摘要 PURPOSE:To obtain a mold release agent which does not cause rust on the surface of a mold even if the mold release agent is applied thereto by using a mixed agent comprising an aqueous solution containing straight-chain alkyl benzene magnesium sulfonate, alkyl ether ester sodium sulfate and alpha-olefin sodium sulfonate as main components, and an aqueous solution containing fatty acid amin salts, potassium salts and borate as main components. CONSTITUTION:A mold release agent is produced by mixing an aqueous solution A with an aqueous solution B while diluting both solutions with water, the aqueous solution A with a concentration of 20 to 30% being prepared by mixing the same amount of each of straight-chain alkyl benzene magnesium sulfonate, alkyl ether ester sodium sulfate and alpha-olefin sodium sulfonate with one another; and the aqueous solution B with a concentration of 50 to 60% being prepared by mixing the same amount of each of fatty acid amin salts, potassium salts and borate with one another. The mixing proportion of the aqueous solutions A and B is desired to be blended so as to be about 1% or more of the total amount of the mold release agent. The mold release agent thus prepared is applied to the molds by an ordinary method such as spray coating and dip coating.
申请公布号 JPH02261609(A) 申请公布日期 1990.10.24
申请号 JP19890083342 申请日期 1989.03.31
申请人 SHOWA ELECTRIC WIRE & CABLE CO LTD 发明人 KIDA TOSHIO;KUDO YUKIHISA
分类号 B29C33/60;B29K19/00;B29K83/00;B29L31/32;(IPC1-7):B29C33/60 主分类号 B29C33/60
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