Teleprinter multiple diode electrodes - are embedded in plastics foam layer secured to aluminium contact plate including resistors

摘要

The multiple semiconductor diode arrangement for a teleprinter has the contacts (13) one side of the diodes (6) connected to one side of the d.c power supply (10) and the other contacts (7) embedded in a plastics foam layer (4). This is mounted on a contact plate (2) of e.g. aluminium, connected to the other side of the power supply. The spaces (12) between the electrodes, and the distance (11) between the ends of the electrodes and the contact plate give the required resistances of a series and parallel resistance network between the diodes and the positive side of the power supply.