| 摘要 |
A machine for blanking an integrated circuit chip from a segment of a film strip held in a fixture, forming its leads, and placing the chip on a multilayer substrate. The fixtures are stacked in a magazine which is mounted on the machine. A transfer mechanism transfers one fixture at a time from the magazine to a punch press where the IC chip is blanked from its film segment, and its leads are formed. The punch is retracted, and a multilayer substrate, which is mounted on an X-Y table, is positioned by the table under the punch so that the excised chip is directly above a chip pad and the chip leads are above the chip lead pads of a predetermined chip pad. The punch is lowered to position the chip on its chip pad. The substrate is coated with an adhesive flux to retain the chips and their leads in place. The punch is retracted and the X-Y table is moved to clear the punch press. A microcomputer controls the machine.
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