| 摘要 |
PURPOSE:To dispense with a post-process, to enhance a tight-seal degree to a large extent and to reduce total cost by mounting the first wafer part having a hole molded by punching the press member supporting a terminal at the time of molding and the second wafer part integrally molded along with the first wafer part and closing said hole. CONSTITUTION:The first wafer part 11 is integrally molded along with a terminal 10. The first wafer part 11 is formed into a box shape opened downwardly and the terminal 10 is embedded in the top part 12 thereof. The terminal 10 is formed so that the under surface thereof is exposed to the inner top surface of the first wafer part 11. When the first wafer part 11 is integrally molded, recessed parts 13 generated by removing a positioning member are formed to the upper and under surfaces of the terminal 10. The second wafer part 14 is molded on the upper surface of the first wafer part 11 so as to close the recessed part 13 on the upper surface side of the terminal 10 to be integrated with the first wafer part 11. Therefore, post-processing for closing a hole is unnecessary and total cost is reduced and a tight-seal degree is enhanced to a large extent. |
