| 摘要 |
The device includes a semiconductor wafer that is cooled on one side, and preferably on both sides, by a liquid cooling system. The system preferably comprises a cylindrical cooling chamber including a relatively thin thermally conductive base wall bonded directly to the wafer for good thermal contact. Liquid coolant is supplied to the base wall, which in turn cools the wafer, through a conduit terminating in a circular flange disposed within the chamber in close proximity to the base wall. The coolant is forced between the flange and base wall and is directed substantially over the entire base wall surface by the flange. The surface of the flange facing the base wall is formed to have a frustro-conical surface to reduce the pressure of the coolant as it flows constrictedly between the flange and base wall as well as to enhance the uniformity of heat transfer across the base wall and thus from the wafer. |
