| 摘要 |
PURPOSE:To improve packaging density by reducing the number of wiring on a packaging plane and reducing size in a longitudinal direction by housing a microwave integrated circuit and a driving circuit for the microwave integrated circuit in a housing case of layer structure, and using a transmission wire with an internal layer in the wiring. CONSTITUTION:The microwave integrated circuit 1 and the driving circuit 4 for the microwave integrated circuit 1 are housed in the housing case of layer structure 7-10 by multiple layer ceramic, and the wiring is applied by utilizing the through holes 13a-13d of the multiple layer ceramic 7-10. Thereby, the number of wires arranged on the same plane can be reduced, which improves the packaging density. Also, the packaging density can be improved even by housing the microwave integrated circuit and the driving circuit for the microwave integrated circuit in the housing case of layer structure, and arranging them in up-and-down directions. |
