摘要 |
A process and apparatus for the manufacture of a continuous web of parallel lead electronic components is provided. Wire for the leads of the components is straightened, cut into uniform predetermined lengths, formed into a U-shaped leadwire and fed onto a continuous moving support band. The parallel leads of the U-shaped lead wires are secured to the support band by adhesive tape at the same time the spacing between the parallel leads is controlled to insure dimensional accuracy. The parallel leads of the open end of the formed lead wires are formed with a cross-over portion and an electronic component element is connected to the formed end. |