首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
HIGH SPEED LEAK INTEGRATING CIRCUIT
摘要
申请公布号
JPS5326560(A)
申请公布日期
1978.03.11
申请号
JP19760100499
申请日期
1976.08.25
申请人
FUJITSU LTD
发明人
MURANO KAZUO;TSUDA TOSHITAKA;HAYASHI TATSUSHIRO
分类号
H03M3/02;H03M7/32
主分类号
H03M3/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Method for device to device communication and base station and user equipment using the same
Two-stage precoding and user grouping for large scale multiple-input multiple-output (MIMO) systems
Systems and methods for transporting digital RF signals
Radio communication system, transmitter, receiver, elevator control system, and substation facility monitoring system
Compression of integer data using a common divisor
Digital-analog converter and digital-analog conversion device executing digital-analog conversion after delta sigma
Adjusting voltage controlled oscillator gain
Programmable buffer system
Digital power gating with programmable control parameter
Resonator, oscillator, electronic apparatus, physical quantity sensor, and mobile object
Method and apparatus for outputting audio signal
Field control device, method of field control, and synchronous rotating machine
Modular switch for an electrical converter, electrical converter, as well as method for operating an electrical converter
Direct power conversion device and method for controlling direct power conversion device
Systems and methods to optimize active current sharing of parallel power converters
L-shaped sheet metal cooling jacket with baffles and integrated power electronics
Management of high-voltage lithium-polymer batteries in portable electronic devices
High capacity batteries with on-demand fast charge capability
Retention module with protection cap
USB plug connector and method for manufacturing the same
