发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To simplify the structure of a clamper, and to obtain a stable loop by forming a metallic small-gage wire holding section of an electrostrictive element displaced in response to bonding operation. CONSTITUTION:When a metallic small-gage wire holding section in a clamper is formed of an electrostrictive element 11 displaced in response to bonding operation, the supply of a metallic small-gage wire 3 can be controlled by the electrostrictive element 11, and the structure of the clamper can be simplified. When the metallic small-gage wire holding section of a capillary 4 is shaped of the electrostrictive element 11 displaced in response to bonding operation, not only no clamper is required but also the supply of the metallic small-gage wire can be controlled by the capillary 4. Accordingly, a stable loop is acquired.
申请公布号 JPH02275648(A) 申请公布日期 1990.11.09
申请号 JP19890203203 申请日期 1989.08.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 MATSUSUMI YASUMI;YOKOYAMA NAOMI;EJIMA TAIZO;SHIRAKAWA KENJI
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址