Multilayer printed circuit board - has internal inter-path connections on same raster as component connections to inner paths

摘要

The multi-layer circuit board is designed to allow a large number of connections both to inner conducting paths and to those paths outside the board and also connections between paths inside the board. The holes for connecting component legs (3) to inner conducting paths (8) are larger than those inter-path connections connecting together inner conducting paths (6, 7), and are spaced on an identical raster with the inter-path connections - i.e. the two types of through or internal connection are located the same place but insulated (10) from one another.