| 摘要 |
A semiconductor device, comprising a lead frame connected to an IC chip in a resinous block and a metallic strip projecting unilaterally from that block along a heat sink, is fastened to that heat sink by a screw traversing aligned holes in the projecting strip portion and in an overlying clamp. The latter has a body of resilient sheet metal, such as brass, bent into a casing around the projecting strip portion and a cantilevered tongue overlying the resinous block, a projection on that tongue bearing upon the block under pressure of the fastening screw. |
