发明名称 Method of making sensitized polyimide polymers, having catalyst and electroless metal, metal deposits thereon and circuit patterns of various metallization schemes
摘要 A method is disclosed for the generation of circuit patterns on a polyimide type of substrate by preconditioning the substrate's surface with a hydrazine/caustic solution, depositing a catalyst on the surface treated polymer, and exposing the polymer with the catalyst thereon to a bath having a metal therein capable of deposition electrolessly on the polymer surface containing catalyst.
申请公布号 US4078096(A) 申请公布日期 1978.03.07
申请号 US19760724810 申请日期 1976.09.20
申请人 AMP INCORPORATED 发明人 REDMOND, JOHN PETER;SHIRK, ALBERT;BOTTIGLIER, ELMER JOHN;ZIMMERMAN, RICHARD HENRY
分类号 C08J7/02;C09K13/02;C23C18/16;C23C18/28;H05K3/38;(IPC1-7):C23C3/02 主分类号 C08J7/02
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