Solder resist applying machine

摘要

A machine and a method for applying a solder resistant material or solder resist to predetermined portions of miniature connector structures are disclosed. The machine permits large numbers of the miniature connector structures to be precisely treated with the solder resist without the need for costly and time consuming masking procedures. More particularly, the miniature connector structures attached to a carrier strip are fed through a hybrid fluid dispensing assembly similar to a bath, which is continuously supplied with the solder resistant material. The quantity of material supplied to the hybrid fluid dispenser or bath is coordinated with the speed at which the miniature connector structures are driven through the bath so that each of the miniature structures absorbs a predetermined amount of solder resistant material by capillary action. The quantity of material absorbed by each of the miniature connector structures is controlled so that it is just sufficient to fill a desired area. The filled connectors are subsequently heated to cure the solder resistant material.