发明名称 METHOD FOR MOLDING DOOR INTEGRALLY WITH PACKING
摘要 PURPOSE:To mold by a general injection molding process by a method wherein normal injection molder is used for molding a door integrally with a packing under the condition that the thickness of an elastic sealing material and the dimension of a cavity in the molder are controlled. CONSTITUTION:A mold for resin is split in two mold halves. When one mold half 3, in which elastic sealing material 2 is inserted, and the other mold half 4 are closed together, the elastic sealing material 2 is held in a cavity under the condition being compressed to a thickness, which is about 80 - 40% of the initial thickness. After that, when molten resin for the main body 1 is injected from the gate 5 of the mold half 4 under the pressure of 1,000 - 2,000kg/cm<2>, the elastic sealing material 2 is compressed to the dimension A. As a result, a space for the main body 1 and a space for the elastic sealing material 2 under the condition being compressed at injection must be provided in advance in the cavity of the mold. The degree of compaction of the elastic sealing material under free state is 85 - 45% (in other words, the residual thickness is 15 - 55%) of the initial thickness, resulting in allowing to show the function as sealing material.
申请公布号 JPH02270522(A) 申请公布日期 1990.11.05
申请号 JP19890090558 申请日期 1989.04.12
申请人 TOHO TEKKO KK 发明人 NOMURA REIJI;OOASHI RIYOUICHI
分类号 B29C45/14;B29L31/00 主分类号 B29C45/14
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