PROCESS AND APPARATUS FOR AUTOMATICALLY CONTROLLING ADHESION QUANTITY OF PLATING,申请号JP19760099046-传众专利搜索

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发明名称	PROCESS AND APPARATUS FOR AUTOMATICALLY CONTROLLING ADHESION QUANTITY OF PLATING
摘要
申请公布号	JPS5323830(A)	申请公布日期	1978.03.04
申请号	JP19760099046	申请日期	1976.08.19
申请人	SEIKO INSTR & ELECTRONICS;NISSHIN STEEL CO LTD	发明人	HAYAMI TSUKASA;SHIMANO KEIJI;SOYA NOBORU;TAFUKU KENJI
分类号	C23C2/20	主分类号	C23C2/20
代理机构		代理人
主权项
地址

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