| 发明名称 |
HALVLEDARANORDNING |
| 摘要 |
In order to efficiently dissipate heat from both sides of a semiconductor device to an associated cooling element, the device is contacted at its two load current conducting sides by conductive contacting elements and the contacting elements are both firmly connected to the cooling element in a thermally conductive and electrically insulating manner. |
| 申请公布号 |
SE7709019(A) |
申请公布日期 |
1978.03.01 |
| 申请号 |
SE19770009019 |
申请日期 |
1977.08.09 |
| 申请人 |
* SEMIKRON GESELLSCHAFT FUR GLEICHRICHTERBAU U ELEKTRONIK;MBH |
发明人 |
W * SCHIERZ;C * BUTENSCHON |
| 分类号 |
H01L23/051;H01L23/31;H01L23/40;H01L23/473;H01L23/492;H01L25/11;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/051 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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