| 摘要 |
<p>PURPOSE:To enable the operation of the titled device to be a highly reliable operation even though the device is left to stand for a long period under a high temperature and a high humidity by a method wherein the device is resin- sealed with a resin composition containing the specified epoxy compound. CONSTITUTION:The resin-sealed semiconductor device is resin-sealed with a resin composition containing the epoxy compounds which are indicated in Formulas I-III. A hardening agent is used together to such the resin composition. As the hardening agent is used a resin polyamine, an aromatic polyamine, amines including the second and third amines, carboxylic acids, carboxylic acid anhydrides, aliphatic and aromatic polyamide oligomers and polymers, boron trifluoride-amine complexes, a carboxylic acid hydrazide, polyamino bismuth imides or so forth. The (m) in II diagram is some of 0, 1 and 2.</p> |
