Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

摘要

A metal-clad laminate is prepd. by (i) applying a release agent to a surface of a substrate, (ii) plating the surface with a conductive metal of thickness 1-20 mu (iii) subjecting the resultant conductive metal layer to a high current density to roughen the exposed surface of the metal, (iv) oxidising the surface, (v) contacting the surface with a bonding agent, (vi) bonding the thus treated conductive metal to a laminate, (vii) removing the substrate, and (vii) recovering the resulting laminate. The metal-clad laminate is also claimed. Esp. useful in forming copper (or other conductive metals such as Ni, Sn, Au etc) clad laminates for use in making printed circuits. The method allows a very thin metal layer to be formed on the laminate so that etching time is greatly reduced, the amt. of etching soln. is smaller, and less undercutting (allowing greater circuit density) occurs.