Electrical circuit element comprising thick film resistor bonded to conductor

摘要

Thick film resistive elements are prepared from an intimate admixture comprising silica, lead oxide and ruthenium dioxide or iridium dioxide which is heated to a temperature sufficient to provide a lead-containing glass having dispersed therein lead ruthenate or lead iridate. The lead-containing glass is comminuted and a resistor paste is formed which can be subsequently coated and fired on to a desired substrate to form the thick film resistive component. The method of this invention may facilitate the production of thick film resistors exhibiting a low temperature coefficient of resistivity, relative freedom from noise and drift, and high moisture resistance.