| 摘要 |
<p>PURPOSE:To contrive stabilization of light-emitting characteristics and a higher mass-producibility, by providing conductor patterns for electrical connection between light-emitting means and driving means for the light-emitting means, on the surface of a substrate. CONSTITUTION:Operations of light-emitting surfaces 22 of light-emitting diode chips 21 are controlled based on printing information transferred to IC chips 23, and light emitted from the light-emitting surfaces 22 is transmitted through a substrate 20 formed of a light-transmitting material to impinge on a photosensitive material. The light-emitting diode chips 21 are fixed by soldering them directly to conductor patterns 29 without using a conductive adhesive. Therefore, the problem of differences in conductivity between the light-emitting diode chips or the like can be obviated, and stable light-emitting characteristics can be obtained. In addition, since it is unnecessary to use gold wires or to provide a protective resin for fixing such gold wires, the number of manufacturing steps can be decreased, and the light-emitting characteristics are not affected at all by such a protective resin.</p> |
