| 发明名称 |
CONDUCTOR FORMING METHOD FOR SEMICONDUCTOR DEVICE BONDING |
| 摘要 |
PURPOSE:To reduce the distortion to be applied to a semiconductor device at the time of bonding the semiconductor device onto an insulator substrate by finely segmenting the bonding conductor regions formed on the back of the semiconductor device, and mutually isolating the segments to discontinuous shapes.
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| 申请公布号 |
JPS5320765(A) |
申请公布日期 |
1978.02.25 |
| 申请号 |
JP19760094485 |
申请日期 |
1976.08.10 |
| 申请人 |
NIPPON TELEGRAPH & TELEPHONE |
发明人 |
MORIKA KUNIO;OOSAKI TAKAAKI;TSUNETSUGU HIDEKI |
| 分类号 |
H01L21/52;H01L21/283 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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