发明名称 |
HERMETIC SEALING METHOD OF ELECTRONIC PARTS |
摘要 |
PURPOSE:To prevent the solder protrusion into the inside by making the pressure difference of the inside and outside gases of the space within the package produced in the cooling process of hermetic sealing through the reduction in pressure of the package outside. |
申请公布号 |
JPS5320860(A) |
申请公布日期 |
1978.02.25 |
申请号 |
JP19760094861 |
申请日期 |
1976.08.11 |
申请人 |
HITACHI LTD |
发明人 |
MURATA AKIRA;KAWAMOTO KAZUTAMI;FUJITA TSUYOSHI |
分类号 |
H05K5/06;H01L21/50;H01L23/02 |
主分类号 |
H05K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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