| 摘要 |
PROBLEM TO BE SOLVED: To perform high-precision alignment of a substrate with high throughput, and also to precisely position a wafer to an exposure position during exposure.SOLUTION: In a mark detection operation by alignment systems (AL1, AL2to AL2), in order to detect a plurality of marks of a wafer W, which have different positions with respect to a Y direction perpendicular to an X direction in an XY plane, in at least part of detection areas of the alignment systems (AL1, AL2to AL2), a control apparatus controls a drive system of a stage WST such that the wafer W is displaced in the Y direction relatively to the plurality of detection areas. An exposure operation of the wafer W uses detection information regarding the marks by the alignment systems.SELECTED DRAWING: Figure 23 |
