| 摘要 |
PURPOSE:To perform the soldering without causing the deviation in the position between an IC chip and a printed circuit board without generating thermal deformation on the circuit board by heating locally the chip positioned on the circuit board by a collet by reflected light of a laser beam. CONSTITUTION:The IC chip 3 is positioned on the flexible printed circuit board 2 mounded on a sample base 1 in the state with the central part of the IC chip 3 sucked on the collet 15 capable of reflecting the laser beam 8 from a peripheral part and solder bumps 6 of the IC chip 3 are allowed to correspond to electrodes on the printed circuit board 2. In this state, the IC chip 3 is press- contacted on the printed circuit board 2 and the laser beam 8 reflected from the peripheral part of the collet 15 is made incident on the rear parts of the solder bumps 6 of the IC chip 3 to melt the solder bumps. As a result, unnecessary heat is not supplied to the printed circuit board 2. Accordingly, the thermal deformation or thermal deterioration is not generated and the deviation in the position between the IC chip 3 and the flexible printed circuit board 2 is not caused. |
