| 摘要 |
Molding composition comprising from 10 to 50 wt.% of the polycondensation product of an alkylene glycol or a mixture of the latter with up to 20 wt.% of 2,2'-bis(4-hydroxycyclohexyl)propane or a halogenated derivative thereof, with an ethylenically unsaturated dicarboxylic acid and a saturated dicaboxylic acid, having a melting point of at least 60 DEG C, an acid value of less than 50 and a Gardner viscosity from Y to Z3, from 0.2 to 2 wt.% of organic peroxide with a decomposition temperature above 70 DEG C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields. |
