| 发明名称 |
WAFER FIXING METHOD |
| 摘要 |
PURPOSE:Beam positioning errors by warpage are reduced and delamination of wafers at the developing is made easy by adhering a wafer to a specimen base by means of beamsensitive resist or the like while applying external pressure along the datum plane of the specimen base. |
| 申请公布号 |
JPS5318969(A) |
申请公布日期 |
1978.02.21 |
| 申请号 |
JP19760093230 |
申请日期 |
1976.08.06 |
| 申请人 |
NIPPON TELEGRAPH & TELEPHONE |
发明人 |
FUJINAMI AKIHIRA;ISHINABE FUMIKO;IWATA ATSUSHI |
| 分类号 |
H01L21/30;G03F7/42;H01L21/027;H01L21/302;H01L21/68;H01L21/683 |
主分类号 |
H01L21/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
