| 摘要 |
PURPOSE:To suppress creation of voids in resin sealing a semiconductor device and improve the reliability of the semiconductor device by a method wherein resin tablets used for transfer molding for sealing the semiconductor device are dehumidified in a near vacuum before they are preheated. CONSTITUTION:In a transfer molding method wherein, after a semiconductor device is placed in a die, preheated resin tablets are cast into the die and the resin tablets are hardened to seal the semiconductor device, the resin tablets are dehumidified in a near vacuum before they are preheated. For instance, after the resin tablets are kept in a vacuum oven whose pressure and temperature are set at 60Torr and 35 deg.C respectively for 3 hours for vacuum dehumidification, the resin tablets are preheated by a conventional method and molded into a required package form. With this constitution, the resin tablets can be dehumidified more securely than with the conventional constitution and creation of voids in the sealing resin can be suppressed. |
