发明名称 Epoxy resin compositions and laminate made therewith
摘要 Epoxy resin compositions comprising a first epoxy resin having a relatively low epoxy equivalent weight of about 170 to 200 and an average functionality of 2 or less, a second epoxy resin having a relatively high epoxy equivalent weight of about 900 to 1900 and an average functionality of 2 or less, and a curing system. Glass fabric is impregnated with the epoxy resin composition and formed into laminates, which are especially useful in the manufacture of printed circuit boards.
申请公布号 US4075260(A) 申请公布日期 1978.02.21
申请号 US19760657777 申请日期 1976.02.13
申请人 GENERAL ELECTRIC COMPANY 发明人 TSEN, LO KWANG;PALKIEWICZ, JOHN LOUIS
分类号 C08G59/22;C08J5/24;H05K1/03;(IPC1-7):C08L63/00 主分类号 C08G59/22
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