| 摘要 |
PURPOSE:To prevent the generation of bridges between the leads of electronic parts which are narrow in inter-lead spacings by placing an absorbing plate which is inclined in the upper part and is made of a metal to be wetted with solder under an object juxtaposed with many parts to be plated and bringing this plate together with the object into contact with molten solder. CONSTITUTION:A QFP is first mounted to the prescribed position of a circuit board 8 and a cap 9 is placed thereon. The cap 9 is fixed by clamps. A jig 4 is lowered onto a molten solder tank 6 by a lifting device 5. The molten solder in the molten solder tank is jetted out by a pump when a base plate 3 of the jig comes into contact with the molten solder tank 6. Then, the molten solder which is jetted and risen intrudes into apertures 10 of the jig and wets the leads 2 of the QFP existing in the apertures. The operation of the pump is stopped to allow the molten solder to descend when the leads 2 are wetted with the molten solder in such a manner. The falling molten solder plates the solder uniformly on the leads at this time. |
