首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
FLUESSIGKRISTALL-ZELLE MIT EINEM GLASFASERRAHMEN
摘要
申请公布号
DE2635942(A1)
申请公布日期
1978.02.16
申请号
DE19762635942
申请日期
1976.08.10
申请人
SIEMENS AG
发明人
KOBALE,MANFRED,DR.;KRUEGER,HANS,DIPL.-PHYS.
分类号
C09J5/00;G02F1/1339;G09F9/30;(IPC1-7):G02F1/13
主分类号
C09J5/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
III-V FIN ON INSULATOR
GATE PLANARITY FOR FINFET USING DUMMY POLISH STOP
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
SEMICONDUCTOR DEVICE
SEMICONDUCTOR PACKAGE WITH EMBEDDED CAPACITOR AND METHODS OF MANUFACTURING SAME
ORGANIC LIGHT-EMITTING DISPLAY DEVICES AND METHODS OF MANUFACTURING ORGANIC LIGHT-EMITTING DISPLAY DEVICES
IMAGING DEVICE, MODULE, ELECTRONIC DEVICE, AND METHOD OF OPERATING THE IMAGING DEVICE
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
SEMICONDUCTOR DEVICE WITH REDUCED POLY SPACING EFFECT
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
MEMORY CELL WITH OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR DEVICE INTEGRATED THEREIN
LAMINATED CHIP, LAMINATED-CHIP-MOUNTED SUBSTRATE AND MANUFACTURING METHOD OF LAMINATED CHIP
PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
Power-Module Device and Power Conversion Device
SEMICONDUCTOR PACKAGE
Structure and Formation Method of Semiconductor Device Structure
SEMICONDUCTOR AND METHOD OF FABRICATING THE SAME
