发明名称 |
PASSIVATED AND ENCAPSULATED SEMICONDUCTORS |
摘要 |
A semiconductor assembly having a semiconductor and conductive lead members secured thereto by conductive metal contact members is passivated by a layer of fused particles of non-conductive glass and encapsulated in a layer of non-conductive plastic. The product combines the best characteristics of a glass passivated semiconductor and a plastic encapsulated semiconductor while avoiding the disadvantages of both. |
申请公布号 |
AU1678376(A) |
申请公布日期 |
1978.02.16 |
申请号 |
AU19760016783 |
申请日期 |
1976.08.12 |
申请人 |
GENERAL INSTRUMENT CORP. |
发明人 |
MONROE B. GOLDBERG;WILLIAM B. VOORHIS |
分类号 |
H01L23/29;H01L23/31;H01L23/492 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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