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经营范围
发明名称
ELECTRONIC PARTS
摘要
PURPOSE:To prevent the damaging of a SiO2 film at the compression bonding of junction lines by providing junction pads within the SiO2 film having an opening of more than 4 times the junction lines.
申请公布号
JPS5315759(A)
申请公布日期
1978.02.14
申请号
JP19760089104
申请日期
1976.07.28
申请人
HITACHI LTD
发明人
SUZUKI AKIRA
分类号
H01L21/60;H01L21/31;H01L29/41
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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