发明名称 ROOM TEMPERATURE CURING AQUEOUS RESIN COMPOSITIONS
摘要 <p>PURPOSE:A room temperature curing aqueous resin composition having improved resistance to solvents, chemicals and water, weatherability, adhesiveness and performance, etc., comprosing a copolymer consisting of specific monomers having ethylenically unsaturated double bonds, and a water-soluble epoxy resin.</p>
申请公布号 JPS5316061(A) 申请公布日期 1978.02.14
申请号 JP19760090317 申请日期 1976.07.30
申请人 TOYO SODA MFG CO LTD 发明人 KURIHARA KENJI;KASAHARA JIYUUICHI;SUZUKI TAKASHI
分类号 C08L57/00;C08G59/00;C08L31/00;C08L33/00;C08L33/02;C08L33/14;C08L39/08;C08L43/02;C08L57/04;C08L57/12;C08L63/00;C09D11/00;C09D11/10;C09D163/00;C09D201/02;C09J137/00;C09J201/00;C23C18/30;H05K3/18 主分类号 C08L57/00
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