| 发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
| 摘要 |
PURPOSE:To obtain a circuit base plate for wireless bonding of ICs having heat resistance and high mechanical strength and possessing bumps which are easy to provided dimensional accuracy. |
| 申请公布号 |
JPS5315071(A) |
申请公布日期 |
1978.02.10 |
| 申请号 |
JP19760089380 |
申请日期 |
1976.07.27 |
| 申请人 |
|
发明人 |
|
| 分类号 |
G04C3/00;G04G17/04;G04G99/00;H01L21/60;H01L23/12;H05K1/02;H05K1/18;H05K3/24 |
主分类号 |
G04C3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
