发明名称 LEAD FRAME AND MANUFACTURE OF ELECTRONIC COMPONENT PACKAGE USING SAME
摘要 PURPOSE:To facilitate various processes for leads and to bond the leads to a lead frame at a high positional accuracy by a method wherein the bending leads are connected to the frame at their points and the straight lead is connected to the frame at the point of a supporting piece which is branched from the straight lead. CONSTITUTION:Bending leads 12 are provided in such a way that they are extruded from a lead frame 10 to the direction of the central part of the frame 10, the connecting end side of each lead with the frame 10 is used as a lead end and an end part 12a on the side, which faces the frame 10, of each lead 12 is used as a soldering part to a package main body. Moreover, a straight lead 14 which is soldered to the package main body without bending its point is connected to the frame 10 through a supporting piece 16, which is branched from the straight lead, and is supported by the frame 10. The lead point side of the lead 14 is extended in the direction of the frame 10 in parallel to the lead point side of each lead 12 and the point of the lead 14 is separated from the frame 10. That is, the point is put in a free state. A scheduled cutting part 14a provided at an arm 14b of the piece 16 is separated from the piece 16 after the lead 14 is soldered.
申请公布号 JPH02281610(A) 申请公布日期 1990.11.19
申请号 JP19890102323 申请日期 1989.04.22
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIZUKAMI MASAYUKI
分类号 H01G13/00;H01L21/52;H01L23/08;H01L23/50 主分类号 H01G13/00
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