| 发明名称 |
Copper thick film conductor |
| 摘要 |
A method of making a copper thick film conductor paste which includes the step of preoxidizing a controlled amount of the copper powder particles. A copper thick film conductor paste, and an electrical conductor element and a method of making it from the paste.
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| 申请公布号 |
US4072771(A) |
申请公布日期 |
1978.02.07 |
| 申请号 |
US19750636074 |
申请日期 |
1975.11.28 |
| 申请人 |
BALA ELECTRONICS CORPORATION |
发明人 |
GRIER, SR., JOHN D. |
| 分类号 |
H01B1/16;H05K1/09;(IPC1-7):B05D5/12;B32B17/06;H01B1/08 |
主分类号 |
H01B1/16 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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