| 摘要 |
<p>PURPOSE:To surely retain a semiconductor wafer and enable washing both surfaces by retaining the outer periphery of the wafer with chuck pawls in a state where the semiconductor wafer is separated from the surface of a chuck main body, and retaining the wafer by pressing the chuck pawls with elastic members. CONSTITUTION:By a conveying means, a semiconductor wafer 1 is moved downward and guided up to the recessed parts 12c, 12d of chuck pawls 12a, 12b. Then the supply of compressed air from a compressor is halted; the air pressure in air cylinders 14a, 14b returns the atmospheric pressure; by the effect of compression springs 15a, 15b, the chuck pawls 12a, 12b are moved in the inner radius direction, and set at a position shown by a full line; the semiconductor wafer is retained in the manner in which the outer periphery is sandwiched by the pawls from both ends. After that, the chuck main body 11 is rotated by the rotation of a motor 5, and drops of water which have attached on the surface of the semiconductor wafer 1 are shook off and eliminated by the effect of centrifugal force.</p> |
