| 发明名称 |
KRETSKORT |
| 摘要 |
The thickness of copper foil at the land formation area of a copper clad laminate of a miniaturized high density circuit is made thicker than the remaining area to assure high reliability of connection between the through hole plating and the land. |
| 申请公布号 |
SE7708675(L) |
申请公布日期 |
1978.02.05 |
| 申请号 |
SE19770008675 |
申请日期 |
1977.07.28 |
| 申请人 |
FUJITSU LTD |
发明人 |
HANABUSA T;YAMAMOTO K;UMEMOTO S;KUROSAWA K;YAMASHITA M |
| 分类号 |
B32B15/04;B32B15/08;C23F1/00;H05K3/06;H05K3/10;H05K3/20;H05K3/42;H05K3/46;(IPC1-7):H05K3/00 |
主分类号 |
B32B15/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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