发明名称 SEMICONDUCTOR DEVICE AND ITS ASSEMBLING DEVICE
摘要 PURPOSE:To let radially extending grooves be produced on the surface of the ball part formed by nail head bonding, increase the area of alloy layers and increase bonding strength by providing radially extending protrusions at the end of a capillary.
申请公布号 JPS5312269(A) 申请公布日期 1978.02.03
申请号 JP19760086835 申请日期 1976.07.20
申请人 NIPPON ELECTRIC CO 发明人 YOSHIDA HIROSHI
分类号 H01L21/603;H01L21/60;H01L23/48 主分类号 H01L21/603
代理机构 代理人
主权项
地址