Integrated circuit protection system - smooths out steps of different height with steep edges by application of solution which decomposes forming silica layer

摘要

A large number of components is produced on a semiconductor chip (1) by diffusion, deposition and/or evaporation processes, with masking and etching. They form steps of different height with steeply falling edges. In order to even out the steps and to flatten the edges, an evening out cover layer (8) is applied on the structured semiconductor chip, so that the chip is covered with a solution which decomposes during centrifuging into a silica cover layer. The contours of the cover layer are sufficiently ently smooth to reduce the risk of mechanical damage to the component.