Multilayer metal contact on semiconductor chip - has three gold and further alloy layers on top

摘要

A first contact layer is made of gold. The gold layer is applied directly on the semiconductor chip, and it is covered with a further gold layer containing a dissociation centres material which determines the conduction type of the chip. The chip may be of n - conduction type. This gold layer is covered with a third gold layer. A series of layers of titanium-palladium-silver or chromium-silver is applied on the gold layers. A layer of titanium 1000 A thick (11) may be applied to the final gold layer (7). A palladium layer may be applied on top of the titanium layer.