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发明名称
POLISHING METHOD OF SEMICONDUCTOR WAFERS
摘要
PURPOSE:To efficiently obtain flat mirror surfaces by fixing wafers through vacuum suction and polishing the top of these wafers.
申请公布号
JPS5310967(A)
申请公布日期
1978.01.31
申请号
JP19760085134
申请日期
1976.07.19
申请人
发明人
分类号
B24B37/30;H01L21/304
主分类号
B24B37/30
代理机构
代理人
主权项
地址
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