| 发明名称 |
Semiconductor polishing pad |
| 摘要 |
The invention is to a polishing pad 14 that has a polishing surface 19 in which portions 17 and 18 of the polishing surface 19 have been removed. The removed areas 17 and 18 are annular rings adjacent an outer 15 and inner 16 edges of the polishing pad 14. The non-polishing surfaces 18 and 19 taper 17a and 18a downward from the polishing surface 19.
|
| 申请公布号 |
US5394655(A) |
申请公布日期 |
1995.03.07 |
| 申请号 |
US19930114532 |
申请日期 |
1993.08.31 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
ALLEN, FRANKLIN L.;SMITH, WILLIAM L.;DEBNER, THOMAS G.;OLMSTEAD, DENNIS L. |
| 分类号 |
B24B37/04;B24D13/14;H01L21/304;(IPC1-7):B24B7/04 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
