THERMOSETTING RESIN COMPOSITIONS AND COPPER CLAD LAMINATES FORMED THEREFROM

摘要

1445994 Laminates MARUZEN OIL CO Ltd 1 Nov 1973 [1 Nov 1972 10 May 1973] 50907/73 Heading B5N [Also in Division C3] Copper clad laminates for printed circuit use may be prepared by impregnating a substrate, particularly a glass cloth, with a composition comprising a poly(hydroxystyrene) and an epoxy resin, drying the impregnated substrate at a temperature which does not completely harden the composition, piling the substrates depending on the thickness of the copper clad laminate desired, superposing a copper foil, which may have been treated with an adhesive, on one or both surfaces of the laminated substrate and then subjecting the whole to heat and pressure. Examples describe the preparation of the intermediate impregnated substrate laminates and copper clad laminates thereof.