| 摘要 |
An apparatus (10) for electrolytic plating of a substrate (44) includes a tank (14) in which a shaft (30) is centrally mounted for rotation about a first axis (28). The shaft carries an arm (40), on the distal end (112) of which is rotatably mounted a fixture wheel (44). The substrate to be plated is carried on the fixture wheel, which rides on an annular track (50) formed on the bottom of the tank around the shaft. A plurality of spaced pins (52) projecting upwardly from the track engage with a plurality of spaced recesses (56) formed about the perimeter (54) of the wheel, so that the wheel rotates about a second axis (64) while revolving around the first axis. The fixture carries a plurality of electrical contact members (46) that contact the substrate. Each contact member is separately supplied with current from a multichannel power supply (22). For each electrical contact member, the fixture includes a separate corresponding conductive brush (162), bushing (142) and lead (48) threaded through the arm and shaft to the corresponding channel of the power supply.
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