| 摘要 |
1535656 Contact pads for semi-conductor devices ITT INDUSTRIES Inc 5 July 1977 [15 July 1976] 28068/77 Heading H1K A semi-conductor device contact pad to which a wire is to be attached by a railhead bond is either pierced (Fig. 3) or divided into partial pads (Fig. 4) in order to provide a large overall pad area while reducing pad-to-substrate capacitance, and the capacitance is further reduced by the provision of a doped surface zone of the opposite conductivity type to the substrate beneath the insulating material underlying the contact pad. |
