| 摘要 |
PROBLEM TO BE SOLVED: To mount electronic parts on an external circuit board simultaneously with other electronic parts by a solder reflow method or a flow solder dipping method even when the electronic parts are composed a multilayered circuit board, IC package, etc., having a weak heat resistance. SOLUTION: In order to prevent the transmission of external heat to electronic parts 4, an electronic parts housing case 1 for mounting is provided. The case 1 is provided with a resin case main body section 3 for housing the parts 4 and a plurality of terminal blocks 6 which are partially buried in the main body section 3 so that the blocks 6 can be positioned along the edge section 5 of the section 3 which controls the opening 2 of the section 3. Each terminal block 6 is connected to the terminals of the parts 4 and, at the same time, soldered to an external circuit board 21. Each terminal block 6 has exposed parts on both surfaces so that heat can be radiated efficiently from the block 6. |
