| 摘要 |
PROBLEM TO BE SOLVED: To produce a multilayer printed wiring board at low cost. SOLUTION: An undercoat resin 3 is applied to a double-sided Cu-clad laminated board 1 having an inner layer circuit 2-1 and cured by ultraviolet rays. An insulative resin 4 previously applied to an outer layer foil 5 is thermocompressed to the board 1 having the circuit 2-1 with the coat of the resin 3 by a laminate roll 11, thereby providing the double-sided Cu-clad laminated board 1 contg. the inner layer circuit 2-1. |
