| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a package wherein there are no air bubbles in the interface of a semiconductor chip and an adhesive agent layer, when a carrier film having the adhesive agent layer and a protruding electrode is used. SOLUTION: A carrier film is so set on a heating stage that a protruding electrode faces upward. A semiconductor chip is so sucked by a tool that an electrode pad faces downward. The carrier film and the semiconductor chip are so position-aligned that the protruding electrode faces the electrode pad. By descending the tool, a load and a temperature are applied to the electrode pad and the protruding electrode, which are electrically connected with each other. By descending further the tool, an adhesive layer is brought into contact with the semiconductor chip surface, and thermo-compression bonding is performed at 300-400 deg.C. Outer electrodes are formed, and the carrier film is cut out. The temperature of the heating stage is made lower than the temperature wherein position-alignment is not hindered by thermal expansion of the carrier film. |
